LeEco, formerly known as LeTV, is working on a new Le 1S successor and is said to be called as the Le 2.
Le 1S has already reached milestones with its quality build, powerful specifications and budget price-tag. Now company seems to have its sight set on next-gen Le 2.
Alleged images of Le 2 smartphone have surfaced online suggesting a metal or metal looking build with a square fingerprint sensor on the back. It also has a new LeEco logo. On the right sid of the phone are the volume rockers and the power button, while the left side hosts SIM slot(s).
The overall design is slightly different, yet more premium than its predecessor. It has Dual speaker vents at booth and USB Type-C port. The phone is said to come in two variants, one with Snapdragon 820 Processor and other with Helio X20 SoC.
The chipset is expected to get the support from 4GB RAM. 21MP primary shooter with LED Flash is also expected on the back.
The phone will support 4G-LTE, 3G HSPA+ networks along with Wi-Fi, Bluetooth, GPS, 3.5mm Audio jack etc.